- Packaging：
-
- Series：
-
- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Peripherals：
-
- Core Processor：
-
- RAM Size：
-
- EEPROM Size：
-
- Data Converters：
-
- Selected conditions:
Discover 84 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | EEPROM Size | Data Converters | Connectivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | EEPROM Size | Data Converters | Connectivity | |
|
|
|
NXP USA Inc. |
346
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 100MAPBGA
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，LVD，POR，WDT | e200z2，e200z4 | - | 80MHz/160MHz | 512K x 8 | - | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
288
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 256MAPBGA
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 512K x 8 | - | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
DUAL CORE 3M FLASH 384K RAM F
|
Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | - | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
180
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 208LQFP
|
Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 208-LQFP | 208-TQFP (28x28) | DMA，POR，PWM，WDT | e200z4d，e200z0h | 177 | 80MHz/120MHz | 256K x 8 | 64K x 8 | A/D 33x10b，10x12b | CANbus，Ethernet，I2C，LINbus，SCI，SPI | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | - | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 100MAPBGA
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，LVD，POR，WDT | e200z2，e200z4 | - | 80MHz/160MHz | 512K x 8 | - | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 880 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，LVD，POR，WDT | e200z2，e200z4 | - | 80MHz/160MHz | 512K x 8 | - | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | - | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | - | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | - | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 256MAPBGA
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 512K x 8 | - | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | - | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | - | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
32 BITDUAL CORE3M FLASH384 RA
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | - | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 256MAPBGA
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 512K x 8 | - | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 256MAPBGA
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 512K x 8 | - | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 176LQFP
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | - | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
32 BITDUAL CORE3M FLASH384 RA
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | - | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 176 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 100MAPBGA
|
Bulk | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，LVD，POR，WDT | e200z2，e200z4 | - | 80MHz/160MHz | 512K x 8 | - | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 176 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 512
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，LVD，POR，WDT | e200z2，e200z4 | - | 80MHz/160MHz | 512K x 8 | - | A/D 80x10b，64x12b | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG |
