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- Supplier Device Package：
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- Core Processor：
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- Program Memory Size：
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- EEPROM Size：
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Discover 100 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
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STMicroelectronics |
200
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3 days |
-
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MOQ: 1 MPQ: 1
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TQFP 64 10X10X1.0 1.
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Tray | SPC58 C-Line | -40°C ~ 125°C | 64-TQFP | 64-QFP (10x10) | DMA | e200z4d | 48 | 180MHz | 4MB (4M x 8) | 128K x 8 | 3.3V，5V | - | Internal | CANbus，I2C，LINbus，SPI | ||
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STMicroelectronics |
200
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3 days |
-
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MOQ: 1 MPQ: 1
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32-BIT POWER ARCHITECTURE MCU FO
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Tray | SPC58 C-Line | -40°C ~ 125°C | 144-TQFP | 144-QFP (20x20) | DMA | e200z4d | 64 | 180MHz | 4MB (4M x 8) | 128K x 8 | 3.3V，5V | - | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | ||
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NXP USA Inc. |
198
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU BATTERY MGMT 416BGA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | 293 | 220MHz | 4MB (4M x 8) | - | 3 V ~ 5.5 V | A/D 40x12b eQADCx2 | External | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | ||
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NXP USA Inc. |
200
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3 days |
-
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MOQ: 1 MPQ: 1
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POWER ARCH CORES 8MB FL
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA，LVD，POR，Zipwire | e200z7 | 293 | 264MHz | 4MB (4M x 8) | - | 3 V ~ 5.5 V | A/D 40x12b eQADCx2 | External | CANbus，EBI/EMI，Ethernet，FlexCANbus，LINbus，SCI，SPI | ||
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NXP USA Inc. |
346
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 3MB FLASH 100MAPBGA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，LVD，POR，WDT | e200z2，e200z4 | - | 80MHz/160MHz | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
288
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 3MB FLASH 256MAPBGA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
200
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3 days |
-
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MOQ: 1 MPQ: 1
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DUAL CORE 3M FLASH 384K RAM F
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
420
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 2MB FLASH 473MAPBGA
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA，POR，PWM，WDT | e200z7d | - | 180MHz | 2MB (2M x 8) | 64K x 8 | 1.14 V ~ 5.5 V | A/D 34x12b | Internal | CANbus，EBI/EMI，Ethernet，FlexRay，I2C，LINbus，SPI | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 2MB FLASH 257MAPBGA
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Tray | MPC56xx Qorivva | -40°C ~ 125°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA，POR，PWM，WDT | e200z7d | - | 180MHz | 2MB (2M x 8) | 64K x 8 | 1.14 V ~ 5.5 V | A/D 22x12b | Internal | CANbus，EBI/EMI，Ethernet，FlexRay，I2C，LINbus，SPI | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 384
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1500 MPQ: 1
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IC MCU 32BIT 3MB FLASH 100MAPBGA
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，LVD，POR，WDT | e200z2，e200z4 | - | 80MHz/160MHz | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 880 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 384
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA，LVD，POR，WDT | e200z2，e200z4 | - | 80MHz/160MHz | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 384
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 384
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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IC MCU 32BIT 3MB FLASH 256MAPBGA
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/160MHz | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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IC MCU 32BIT 4MB FLASH 256MAPBGA
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Tape & Reel (TR) | MPC57xx | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA，LVD，POR，WDT | e200z2，e200z4 | 178 | 80MHz/120MHz | 4MB (4M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 384
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 384
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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32 BITDUAL CORE3M FLASH384 RA
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG |
