Discover 11 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Operating Temperature Package / Case Supplier Device Package Number of I/O Speed
SPC5517EBMLQ66
NXP USA Inc.
300
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 1.5MB FLASH 144LQFP
Tray -40°C ~ 125°C (TA) 144-LQFP 144-LQFP (20x20) 111 66MHz
SPC5517EBVLQ66R
NXP USA Inc.
Inquiry
-
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MOQ: 500  MPQ: 1
IC MCU 32BIT 1.5MB FLASH 144LQFP
Tape & Reel (TR) -40°C ~ 105°C (TA) 144-LQFP 144-LQFP (20x20) 111 66MHz
SPC5517EAVLU66
NXP USA Inc.
200
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 1.5MB FLASH 176LQFP
Tray -40°C ~ 105°C (TA) 176-LQFP 176-LQFP (24x24) 137 66MHz
SPC5517EBMLQ66R
NXP USA Inc.
Inquiry
-
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MOQ: 500  MPQ: 1
NXP 32-BIT MCU POWER ARCH CORE
Tape & Reel (TR) -40°C ~ 125°C (TA) 144-LQFP 144-LQFP (20x20) 111 66MHz
SPC5517EBVLQ66
NXP USA Inc.
Inquiry
-
-
MOQ: 300  MPQ: 1
IC MCU 32BIT 1.5MB FLASH 144LQFP
Tray -40°C ~ 105°C (TA) 144-LQFP 144-LQFP (20x20) 111 66MHz
SPC5517EAMLU66
NXP USA Inc.
Inquiry
-
-
MOQ: 200  MPQ: 1
IC MCU 32BIT 1.5MB FLASH 176LQFP
Tray -40°C ~ 125°C (TA) 176-LQFP 176-LQFP (24x24) 137 66MHz
SPC5517EAMMG66
NXP USA Inc.
Inquiry
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-
MOQ: 90  MPQ: 1
IC MCU 32BIT 1.5MB FLASH 208BGA
Tray -40°C ~ 125°C (TA) 208-BGA 208-MAPBGA (17x17) 144 66MHz
SPC5517GAMMG66
NXP USA Inc.
Inquiry
-
-
MOQ: 90  MPQ: 1
IC MCU 32BIT 1.5MB FLASH 208BGA
Tray -40°C ~ 125°C (TA) 208-BGA 208-MAPBGA (17x17) 144 66MHz
SPC5517GAVMG80
NXP USA Inc.
Inquiry
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MOQ: 450  MPQ: 1
IC MCU 32BIT 1.5MB FLASH 208BGA
Tray -40°C ~ 125°C (TA) 208-BGA 208-MAPBGA (17x17) 144 80MHz
SPC5517EAVLQ66
NXP USA Inc.
Inquiry
-
-
MOQ: 60  MPQ: 1
NXP 32-BIT MCU POWER ARCH CORE
Tray -40°C ~ 105°C (TA) 144-LQFP 144-LQFP (20x20) 111 66MHz
SPC5517EAVMG80
NXP USA Inc.
Inquiry
-
-
MOQ: 450  MPQ: 1
NXP 32-BIT MCU POWER ARCH 1.5M
Tray -40°C ~ 105°C (TA) 208-BGA 208-MAPBGA (17x17) 111 66MHz