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Discover 11 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Number of I/O | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Connectivity | ||
NXP USA Inc. |
Inquiry
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MOQ: 880 MPQ: 1
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DUAL CORE 2M FLASH 256K RAM F
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Tray | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA,I2S,POR,WDT | - | 256K x 8 | 2MB (2M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | ||||
NXP USA Inc. |
Inquiry
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MOQ: 200 MPQ: 1
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DUAL CORE 1.5M FLASH
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Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA,I2S,POR,WDT | 129 | 192K x 8 | 1.5MB (1.5M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | ||||
NXP USA Inc. |
Inquiry
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MOQ: 200 MPQ: 1
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DUAL CORE 2M FLASH
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Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA,I2S,POR,WDT | 129 | 256K x 8 | 2MB (2M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | ||||
NXP USA Inc. |
Inquiry
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MOQ: 1500 MPQ: 1
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DUAL CORE 2M FLASH 256K RAM F
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Tape & Reel (TR) | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA,I2S,POR,WDT | - | 256K x 8 | 2MB (2M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | ||||
NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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DUAL CORE 1.5M FLASH
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Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA,I2S,POR,WDT | - | 192K x 8 | 1.5MB (1.5M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | ||||
NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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DUAL CORE 2M FLASH
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA,I2S,POR,WDT | - | 256K x 8 | 2MB (2M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | ||||
NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 880 MPQ: 1
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DUAL CORE,3M FLASH,256
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Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA,LVD,POR,WDT | - | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 200 MPQ: 1
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DUAL CORE,3M FLASH,384
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Tray | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA,LVD,POR,WDT | 129 | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
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-
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MOQ: 200 MPQ: 1
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32 BIT3M FLASH384 RAM
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Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA,LVD,POR,WDT | 129 | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b,64x12b | CANbus,Ethernet,I2C,LINbus,SAI,SPI,USB,USB OTG | ||||
NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 450 MPQ: 1
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DUAL CORE 2M FLASH 256
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Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA,I2S,POR,WDT | 178 | 256K x 8 | 2MB (2M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI | ||||
NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1000 MPQ: 1
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DUAL CORE 2M FLASH 256
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Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA,I2S,POR,WDT | - | 256K x 8 | 2MB (2M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b,16x12b | CANbus,Ethernet,FlexRay,I2C,LINbus,SPI |