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Discover 94 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | |
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Infineon Technologies |
Inquiry
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-
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MOQ: 500 MPQ: 1
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IC MCU 32BIT 4MB FLASH 176LQFP
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Tape & Reel (TR) | AURIX | -40°C ~ 125°C (TA) | 176-LQFP | DMA，WDT | TriCore | 112 | 200MHz | 472K x 8 | 4MB (4M x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 40x12b，6 x Sigma-Delta | External | ASC，CANbus，Ethernet，FlexRay，HSSL，I2C，LINbus，MSC，PSI5，QSPI，SENT | ||
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Infineon Technologies |
454
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 4MB FLASH 176LQFP
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Cut Tape (CT) | AURIX | -40°C ~ 125°C (TA) | 176-LQFP | DMA，WDT | TriCore | 112 | 200MHz | 472K x 8 | 4MB (4M x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 40x12b，6 x Sigma-Delta | External | ASC，CANbus，Ethernet，FlexRay，HSSL，I2C，LINbus，MSC，PSI5，QSPI，SENT | ||
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Infineon Technologies |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 4MB FLASH 176LQFP
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- | AURIX | -40°C ~ 125°C (TA) | 176-LQFP | DMA，WDT | TriCore | 112 | 200MHz | 472K x 8 | 4MB (4M x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 40x12b，6 x Sigma-Delta | External | ASC，CANbus，Ethernet，FlexRay，HSSL，I2C，LINbus，MSC，PSI5，QSPI，SENT | ||
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NXP USA Inc. |
69
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 2MB FLASH 176LQFP
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Tray | Automotive，AEC-Q100 MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP | DMA，LVD，POR，Zipwire | e200z4 | - | 200MHz | 128K x 8 | 2MB (2M x 8) | - | 3.5 V ~ 5.5 V | A/D 12b SAR，16b Sigma-Delta | Internal | CANbus，Ethernet，I2C，LINbus，SCI，SPI，UART/USART | ||
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NXP USA Inc. |
200
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3 days |
-
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MOQ: 1 MPQ: 1
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DUAL CORE 3M FLASH 384K RAM F
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
200
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 1.5MB FLASH 176LQFP
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Tray | MPC56xx Qorivva | -40°C ~ 105°C (TA) | 176-LQFP | DMA，POR，PWM，WDT | e200z4d，e200z0h | 147 | 80MHz/120MHz | 192K x 8 | 1.5MB (1.5M x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 27x10b，5x12b | Internal | CANbus，Ethernet，I2C，LINbus，SCI，SPI | ||
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NXP USA Inc. |
200
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 1.5MB FLASH 176LQFP
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Tray | MPC56xx Qorivva | -40°C ~ 105°C (TA) | 176-LQFP | DMA，POR，PWM，WDT | e200z4d，e200z0h | 147 | 80MHz/120MHz | 192K x 8 | 1.5MB (1.5M x 8) | 64K x 8 | 3 V ~ 5.5 V | A/D 27x10b，5x12b | Internal | CANbus，Ethernet，I2C，LINbus，SCI，SPI | ||
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NXP USA Inc. |
200
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 1.5MB FLASH 176LQFP
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Tray | MPC55xx Qorivva | -40°C ~ 105°C (TA) | 176-LQFP | DMA，POR，PWM，WDT | e200z0，e200z1 | 137 | 66MHz | 80K x 8 | 1.5MB (1.5M x 8) | - | 4.5 V ~ 5.25 V | A/D 40x12b | Internal | CANbus，EBI/EMI，I2C，SCI，SPI | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 500 MPQ: 1
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32 BIT DUAL CORE 3M FLASH 384
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
DUAL CORE 1.5M FLASH
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Tray | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | DMA，I2S，POR，WDT | e200z2，e200z4 | 129 | 80MHz，160MHz | 192K x 8 | 1.5MB (1.5M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
DUAL CORE 2M FLASH
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | DMA，I2S，POR，WDT | e200z2，e200z4 | 129 | 80MHz，160MHz | 256K x 8 | 2MB (2M x 8) | 64K x 8 | 3.15 V ~ 5.5 V | A/D 36x10b，16x12b | Internal | CANbus，Ethernet，FlexRay，I2C，LINbus，SPI | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
32 BIT DUAL CORE 3M FLASH 384
|
Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
|
32 BITDUAL CORE3M FLASH384 RA
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Tape & Reel (TR) | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MCU 32BIT 4MB FLASH 176LQFP
|
Tape & Reel (TR) | MPC57xx | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | 4MB (4M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
IC MCU 32BIT 3MB FLASH 176LQFP
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 200 MPQ: 1
|
32 BITDUAL CORE3M FLASH384 RA
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Tray | MPC57xx | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | DMA，LVD，POR，WDT | e200z2，e200z4 | 129 | 80MHz/160MHz | 512K x 8 | 3MB (3M x 8) | - | 3 V ~ 5.5 V | A/D 80x10b，64x12b | Internal | CANbus，Ethernet，I2C，LINbus，SAI，SPI，USB，USB OTG |
