- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
Discover 16 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | ||
Xilinx Inc. |
35
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 520 I/O 1156FCBGA
|
-40°C ~ 100°C (TJ) | 1156-BBGA,FCBGA | 1156-FCBGA (35x35) | 520 | ||||
Xilinx Inc. |
24
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 520 I/O 1156FCBGA
|
0°C ~ 100°C (TJ) | 1156-BBGA,FCBGA | 1156-FCBGA (35x35) | 520 | ||||
Xilinx Inc. |
3
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 312 I/O 676FCBGA
|
-40°C ~ 100°C (TJ) | 676-BBGA,FCBGA | 676-FCBGA (27x27) | 312 | ||||
Xilinx Inc. |
3
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 312 I/O 676FCBGA
|
0°C ~ 85°C (TJ) | 676-BBGA,FCBGA | 676-FCBGA (27x27) | 312 | ||||
Xilinx Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 520 I/O 1156FCBGA
|
0°C ~ 85°C (TJ) | 1156-BBGA,FCBGA | 1156-FCBGA (35x35) | 520 | ||||
Xilinx Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 468 I/O 784FCBGA
|
0°C ~ 85°C (TJ) | 784-BBGA,FCBGA | 784-FCCSPBGA (23x23) | 468 | ||||
Xilinx Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 468 I/O 900FCBGA
|
0°C ~ 85°C (TJ) | 900-BBGA,FCBGA | 900-FCBGA (31x31) | 468 | ||||
Xilinx Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 468 I/O 784FCBGA
|
-40°C ~ 100°C (TJ) | 784-BBGA,FCBGA | 784-FCCSPBGA (23x23) | 468 | ||||
Xilinx Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 468 I/O 900FCBGA
|
-40°C ~ 100°C (TJ) | 900-BBGA,FCBGA | 900-FCBGA (31x31) | 468 | ||||
Xilinx Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 468 I/O 784FCBGA
|
0°C ~ 100°C (TJ) | 784-BBGA,FCBGA | 784-FCCSPBGA (23x23) | 468 | ||||
Xilinx Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 312 I/O 676FCBGA
|
0°C ~ 100°C (TJ) | 676-BBGA,FCBGA | 676-FCBGA (27x27) | 312 | ||||
Xilinx Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 468 I/O 900FCBGA
|
0°C ~ 100°C (TJ) | 900-BBGA,FCBGA | 900-FCBGA (31x31) | 468 | ||||
Xilinx Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 468 I/O 784FCBGA
|
-40°C ~ 100°C (TJ) | 784-BBGA,FCBGA | 784-FCCSPBGA (23x23) | 468 | ||||
Xilinx Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
XCKU040-2FBVA676I
|
-40°C ~ 100°C (TJ) | 676-BBGA,FCBGA | 676-FCBGA (27x27) | 312 | ||||
Xilinx Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
XCKU040-2FBVA900I
|
-40°C ~ 100°C (TJ) | 900-BBGA,FCBGA | 900-FCBGA (31x31) | 468 | ||||
Xilinx Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
XCKU040-2FFVA1156I
|
-40°C ~ 100°C (TJ) | 1156-BBGA,FCBGA | 1156-FCBGA (35x35) | 520 |