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Discover 10 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Output | Frequency - Max | Type | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Output | Frequency - Max | Type | ||
ON Semiconductor |
Inquiry
|
- |
-
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MOQ: 160 MPQ: 1
|
IC CLK BUFFER 2:15 1.5GHZ 52LQFP
|
Tray | 100LVE | 3 V ~ 5.25 V | -40°C ~ 85°C | 52-LQFP | 52-LQFP (10x10) | LVECL,LVPECL | ECL | 1.5GHz | Fanout Buffer (Distribution),Divider,Multiplexer | ||||
ON Semiconductor |
Inquiry
|
- |
-
|
MOQ: 1500 MPQ: 1
|
IC CLK BUFFER 2:15 1.5GHZ 52LQFP
|
Tape & Reel (TR) | 100LVE | 3 V ~ 5.25 V | -40°C ~ 85°C | 52-LQFP | 52-LQFP (10x10) | LVECL,LVPECL | ECL | 1.5GHz | Fanout Buffer (Distribution),Divider,Multiplexer | ||||
IDT,Integrated Device Technology Inc |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC CLK BUFFER 2:15 3GHZ 52PTQFP
|
Tray | 100ES | 2.375 V ~ 3.465 V | -40°C ~ 110°C | 52-LQFP Exposed Pad | 52-PTQFP (10x10) | ECL,PECL | LVPECL | 3GHz | Fanout Buffer (Distribution),Divider,Multiplexer,PLL | ||||
IDT,Integrated Device Technology Inc |
Inquiry
|
- |
-
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MOQ: 1500 MPQ: 1
|
IC CLK BUFFER 2:15 3GHZ 52PTQFP
|
Tape & Reel (TR) | 100ES | 2.375 V ~ 3.465 V | -40°C ~ 110°C | 52-LQFP Exposed Pad | 52-PTQFP (10x10) | ECL,PECL | LVPECL | 3GHz | Fanout Buffer (Distribution),Divider,Multiplexer,PLL | ||||
Microchip Technology |
1,000
|
3 days |
-
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MOQ: 1000 MPQ: 1
|
2.5V/3.3V INTEGRATED DIVIDER + F
|
Tape & Reel (TR) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 64-TQFP Exposed Pad | 64-EP-TQFP | CML,LVDS,PECL | LVPECL | 2GHz | Fanout Buffer (Distribution),Divider,Multiplexer | ||||
Microchip Technology |
1,000
|
3 days |
-
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MOQ: 1 MPQ: 1
|
2.5V/3.3V INTEGRATED DIVIDER + F
|
Cut Tape (CT) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 64-TQFP Exposed Pad | 64-EP-TQFP | CML,LVDS,PECL | LVPECL | 2GHz | Fanout Buffer (Distribution),Divider,Multiplexer | ||||
Microchip Technology |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
2.5V/3.3V INTEGRATED DIVIDER + F
|
- | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 64-TQFP Exposed Pad | 64-EP-TQFP | CML,LVDS,PECL | LVPECL | 2GHz | Fanout Buffer (Distribution),Divider,Multiplexer | ||||
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC CLK BUFFER 2:15 2GHZ 64TQFP
|
Tray | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 64-TQFP Exposed Pad | 64-EP-TQFP | CML,LVDS,PECL | LVPECL | 2GHz | Fanout Buffer (Distribution),Divider,Multiplexer | ||||
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC CLK BUFFER 2:15 2GHZ 64TQFP
|
Tray | Precision Edge | 2.375 V ~ 2.625 V | -40°C ~ 85°C | 64-TQFP Exposed Pad | 64-EP-TQFP | CML,LVDS,PECL | LVDS | 2GHz | Fanout Buffer (Distribution),Divider,Multiplexer | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC CLK BUFFER 2:15 3GHZ 52LQFP
|
Tray | 100ES | 2.375 V ~ 3.465 V | -40°C ~ 110°C | 52-LQFP Exposed Pad | 52-LQFP (10x10) | ECL,PECL | ECL,PECL | 3GHz | Fanout Buffer (Distribution),Divider,Multiplexer |