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Discover 115 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Features | Ratings | Dimensions - Overall | Voltage | Current | Weight | Product Type | Power - Cooling | Flow Rate | Power Input | Thermal Resistance @ GPM | Fluid Capacity | Connection Type | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Features | Ratings | Dimensions - Overall | Voltage | Current | Weight | Product Type | Power - Cooling | Flow Rate | Power Input | Thermal Resistance @ GPM | Fluid Capacity | Connection Type | |
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Aavid，Thermal Division of Boyd Corporation |
47
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK 0.01C/W
|
Hi-Contact | - | - | 15.19" L x 7.00" W x 0.60" H (385.8mm x 177.8mm x 15.2mm) | - | - | - | Passive，Cold Plate | - | - | - | 0.010°C/W @ 1.0 GPM | - | - | ||
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Wakefield-Vette |
29
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK EXPOSED
|
- | - | - | 9.19" L x 7.00" W x 0.60" H (233.4mm x 177.8mm x 15.2mm) | - | - | - | Passive，Cold Plate | - | - | - | - | - | - | ||
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|
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Wakefield-Vette |
119
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
STANDARD VAPOR CHAMBER 113.1X81.
|
VC | VGA Platform | - | 4.45" L x 3.22" W x 0.22" H (113.1mm x 81.8mm x 5.7mm) | - | - | - | Vapor Chamber | 180W | - | - | - | - | - | ||
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Aavid，Thermal Division of Boyd Corporation |
50
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK 0.02C/W
|
Hi-Contact | - | - | 9.00" L x 5.00" W x 0.60" H (228.6mm x 127.0mm x 15.2mm) | - | - | - | Passive，Cold Plate | - | - | - | 0.020°C/W @ 1.0 GPM | - | - | ||
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|
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Aavid，Thermal Division of Boyd Corporation |
25
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK 0.006C/W
|
Hi-Contact | - | - | 27.19" L x 7.00" W x 0.60" H (690.6mm x 177.8mm x 15.2mm) | - | - | - | Passive，Cold Plate | - | - | - | 0.006°C/W @ 1.0 GPM | - | - | ||
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|
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Wakefield-Vette |
14
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK BURIED
|
- | - | - | 27.19" L x 7.00" W x 0.60" H (690.6mm x 177.8mm x 15.2mm) | - | - | - | Passive，Cold Plate | - | - | - | - | - | - | ||
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Laird Technologies - Engineered Thermal Solutions |
3
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT EXCHANGER 230V 6LPM 3000W
|
WL | Adjustable Flow Rate，Bypass Valve Protection | - | 18.86" L x 15.67" W x 18.94" H (479.0mm x 398.0mm x 481.0mm) | 230VAC | 2.5A | 85 lbs (38.6kg) | Active，Heat Exchanger | 3000W | 1.59GPM (6.0LPM) | - | - | 3700ML (125.1 oz) | 9mm Press Fit | ||
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Laird Technologies - Engineered Thermal Solutions |
13
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
RECIRC CHILLER 3.3LPM 290W 8.5A
|
MRC | Temperature Control | UL61010-1 | 13.31" L x 7.99" W x 15.39" H (338.0mm x 203.0mm x 391.0mm) | 115 ~ 240VAC | 8.5A | 30 lbs (13.6kg) | Active，Recirculating Chiller | 290W | 0.87GPM (3.3LPM) | 507W | - | 450ML (15.2 oz) | 3/8" Quick Connect | ||
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Wakefield-Vette |
26
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK BURIED
|
- | - | - | 5.25" L x 2.25" W x 0.60" H (133.4mm x 57.2mm x 15.2mm) | - | - | - | Passive，Cold Plate | - | - | - | - | - | - | ||
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|
|
Wakefield-Vette |
61
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK EXPOSED
|
- | - | - | 5.25" L x 2.25" W x 0.66" H (133.4mm x 57.2mm x 16.8mm) | - | - | - | Passive，Cold Plate | - | - | - | - | - | - | ||
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|
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Wakefield-Vette |
7
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK 0.041C/W
|
180 | - | - | 19.41" L x 3.00" W x 0.63" H (429.9mm x 76.2mm x 15.9mm) | - | - | 1.7 lbs (771.1g) | Passive，Cold Plate | - | - | - | 0.041°C/W @ 1.5 GPM | - | - | ||
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|
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Wakefield-Vette |
16
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK 0.038C/W
|
180 | - | - | 13.41" L x 7.75" W x 0.66" H (340.5mm x 196.9mm x 16.7mm) | - | - | 2.3 lbs (1kg) | Passive，Cold Plate | - | - | - | 0.038°C/W @ 1.0 GPM | - | - | ||
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|
|
Aavid，Thermal Division of Boyd Corporation |
32
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK 0.06C/W
|
Hi-Contact | - | - | 5.25" L x 2.25" W x 0.60" H (133.4mm x 57.2mm x 15.2mm) | - | - | - | Passive，Cold Plate | - | - | - | 0.060°C/W @ 1.5 GPM | - | - | ||
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|
Ohmite |
37
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK 0.43C/W
|
CP | - | - | 4.50" L x 6.00" W x 0.75" H (114.3mm x 152.4mm x 19.1mm) | - | - | 1.8 lbs (816.5g) | Passive，Cold Plate | - | - | - | 0.018°C/W @ 1.5 GPM | - | - | ||
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|
|
Wakefield-Vette |
16
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK 0.018C/W
|
180 | - | - | 19.41" L x 7.75" W x 0.66" H (492.9mm x 196.9mm x 16.7mm) | - | - | 4.3 lbs (2kg) | Passive，Cold Plate | - | - | - | 0.018°C/W @ 1.0 GPM | - | - | ||
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|
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Wakefield-Vette |
5
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK 0.02C/W
|
180 | - | - | 31.69" L x 5.00" W x 0.69" H (804.9mm x 127.2mm x 17.5mm) | - | - | 5.7 lbs (2.6kg) | Passive，Cold Plate | - | - | - | 0.020°C/W @ 1.5 GPM | - | - | ||
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|
|
Aavid，Thermal Division of Boyd Corporation |
8
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK 0.0055C/W
|
Hi-Contact | - | - | 15.00" L x 5.00" W x 0.60" H (381.0mm x 127.0mm x 15.2mm) | - | - | - | Passive，Cold Plate | - | - | - | 0.0055°C/W @ 2.0 GPM | - | - | ||
|
|
|
Wakefield-Vette |
11
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK BURIED
|
- | - | - | 9.19" L x 7.00" W x 0.60" H (233.4mm x 177.8mm x 15.2mm) | - | - | - | Passive，Cold Plate | - | - | - | - | - | - | ||
|
|
|
Wakefield-Vette |
20
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK EXPOSED
|
- | - | - | 15.00" L x 5.00" W x 0.66" H (381.0mm x 127.0mm x 16.8mm) | - | - | - | Passive，Cold Plate | - | - | - | - | - | - | ||
|
|
|
Wakefield-Vette |
20
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK BURIED
|
- | - | - | 15.19" L x 7.00" W x 0.60" H (385.8mm x 177.8mm x 15.2mm) | - | - | - | Passive，Cold Plate | - | - | - | - | - | - |
